10 interview questions and answers on Chiplet based SoC Architecture

Here’s a list of questions and answers about the Chiplet based SoC Architecture. This guide can help you prepare for job interviews for Chiplet based SoC Architecture skill requirements.

List of 10 Chiplet based SoC Architecture Questions and Answers

Question 1: What is a chiplet?

Answer 1: A small, specialized integrated circuit that performs a specific function within a larger SoC.

Question 2: How do chiplets differ from monolithic chips?

Answer 2: Chiplets are modular and can be assembled like building blocks, unlike a single large silicon die.

Question 3: What is the key advantage of chiplets?

Answer 3: Improved yield and flexibility, allowing reuse of tested dies and reduced manufacturing costs.

Question 4: What is 2.5D integration?

Answer 4: A packaging method where chiplets are placed side by side on an interposer for interconnection.

Question 5: What is the purpose of UCIe?

Answer 5: Universal Chiplet Interconnect Express – a standard interface for connecting chiplets.

Question 6: What packaging technologies are used for chiplets?

Answer 6: EMIB, CoWoS, Foveros, and interposers.

Question 7: Which companies are leading in chiplet based design?

Answer 7: AMD (with Infinity Fabric), Intel and TSMC.

Question 8: What are the design challenges in chiplet integration?

Answer 8: Thermal management, signal integrity and inter chiplet communication.

Question 9: Can chiplets be fabricated using different process nodes?

Answer 9: Yes, enabling mixing of analog and digital blocks on varying nodes (e.g., 5nm + 28nm).

Question 10: What is Heterogeneous Integration?

Answer 10: Combining diverse chiplets (CPU, GPU, memory) in one package to improve performance and flexibility.