dielectric material vs resistive material

This page on dielectric material vs resistive material describes difference between dielectric material and resistive material. Both of these materials are used in MMIC fabrication.

The dielectric material should have following properties:
•  higher voltage withstanding power
•  low dielectric loss
•  Good reproducibility

The resistive material should have following properties:
•  Low temperature coefficient resistance
•  Good stability
• Good heat dissipation ability
•  higher surface resistivities

Table below describes materials,their deposition method and more for both dielectric and resistive materials.

Dielectric material

Dielectric Material Deposition technique εr
SiO Evaporation 6-8
SiO2 deposition,sputtering 4
Al2O3 Anodization,evaporation 7-10
Ta2O5 Anodization,sputtering 22-25

Resistive material

Resistive Material Deposition technique Resistivity, Ohm/Square
Cr Evaporation 10-1000
NiCr Evaporation 40-400
Ta sputtering 5-100
Ti Evaporation 5-2000
Cr-SiO Evaporation 600

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