dielectric material vs resistive material
This page on dielectric material vs resistive material describes difference between dielectric material and resistive material. Both of these materials are used in MMIC fabrication.
The dielectric material should have following properties:
• higher voltage withstanding power
• low dielectric loss
• Good reproducibility
The resistive material should have following properties:
• Low temperature coefficient resistance
• Good stability
• Good heat dissipation ability
• higher surface resistivities
Table below describes materials,their deposition method and more for both dielectric and resistive materials.
Dielectric material
| Dielectric Material | Deposition technique | εr |
|---|---|---|
| SiO | Evaporation | 6-8 |
| SiO2 | deposition,sputtering | 4 |
| Al2O3 | Anodization,evaporation | 7-10 |
| Ta2O5 | Anodization,sputtering | 22-25 |
Resistive material
| Resistive Material | Deposition technique | Resistivity, Ohm/Square |
|---|---|---|
| Cr | Evaporation | 10-1000 |
| NiCr | Evaporation | 40-400 |
| Ta | sputtering | 5-100 |
| Ti | Evaporation | 5-2000 |
| Cr-SiO | Evaporation | 600 |
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