App-Notes » Teradyne Automated Test Equipment (ATE) for semiconductor IC testing

Teradyne Automated Test Equipment (ATE) for semiconductor IC testing

automatic test equipment ate teradyne semiconductor ic testing

Introduction

As semiconductor ICs become increasingly complex with billions of transistors packed into smaller footprints. Mmanual testing is no longer viable. Hence Automated Test Equipment (ATE) systems offer high speed, accurate and repeatable testing solutions that can handle digital, analog, mixed signal and RF ICs efficiently. ATE plays a pivotal role in the semiconductor industry, ensuring the functionality, reliability and performance of integrated circuits (ICs) across various stages of development and production.

Test Cases for semiconductor IC

Following table mentions test cases for different types of ICs which include analog ICs, digital ICs, mixed signal ICs, Memory ICs, RF and Wireless ICs and power management ICs.

IC typeTest Cases
Analog ICsGain, Offset, Linearity Testing, THD (Total Harmonic Distortion), Signal to Noise Ratio (SNR), PSRR (Power Supply Rejection Ratio), Noise and Bandwidth Measurements etc.
Digital ICsFunctional Testing, Scan Chain Test, Stuck at Fault Testing, Transition Delay Testing, IDDQ Testing
Mixed Signal ICsINL/DNL (Integral and Differential Non-Linearity), Dynamic Testing (SINAD, ENOB), Sampling Rate and Conversion Time
Memory ICsRead/Write Cycle Testing, Address/Command/Timing Verification, Retention and Refresh Tests, Bit Line Stability and Sense Amp Tests
RF and Wireless ICsS-Parameter Measurement, Power Output, Gain, NF (Noise Figure), Phase Noise, EVM (Error Vector Magnitude), Modulation Accuracy Testing
Power Management ICsVoltage Regulation Accuracy, Dropout Voltage, Load Regulation, Line Regulation, Protection Feature Tests (OCP, OVP, OTP)

Generic features of ATE in semiconductor tests

  • High speed analog and digital test capabilities
  • Enables simultaneous testing of multiple chips
  • Parametric testing including measurement of DC characteristics such as current, voltage, resistance etc.
  • Mixed signal testing , crucial for DACs, ADCs, SoCs
  • Precise timing generators and clocks to match IC’s requirements
  • Generates stimulus vectors and compares output patterns for logic validation
  • Programmable using C++, Python, STIL etc.
  • Support for package level (using test sockets) and wafer level testing (using probe stations)
  • Automates IC loading/unloading to the test head

Key features of Teradyne UltraFLEX (SoC) ATE

  • The UltraFLEX system offers superior flexibility, scalability and throughput.
  • It offers maximum test quality and yield.
  • It offers reduction in cost of test (CoT).
  • It speeds time to market.
  • It can perform parallel test operations and integrate multiple test sites on a single handler.
  • Designed for 5G and mmwave chipsets.
  • Available in 12-slot and 24-slot
  • Other Popular ATE Systems: UltraFLEXplus, J750 (low- to mid-range ICs), Magnum (memory IC testing)
  • Check out : Teradyne UltraFLEX Features

Other ATE manufacturers for semiconductor testing

Following are top ATE manufacturers for semiconductor IC.

  1. Advantest Corporation (Japan)
  2. Teradyne Inc. (USA)
  3. Cohu, Inc. (USA)
  4. National Instruments (NI), now part of Emerson Electric
  5. ATE Solutions Ltd. (UK)
  6. Chroma ATE Inc. (Taiwan)
  7. UniTest Inc. (South Korea)
  8. Astronics Test Systems (USA)

Conclusion

As IC designs evolve to support AI, 5G, automotive, and IoT applications, ATE continues to advance with high-speed interfaces, parallel testing capabilities and AI-driven analytics to meet future challenges. By integrating ATE into the semiconductor production lifecycle, manufacturers can ensure product quality, optimize performance and stay competitive in the rapidly evolving electronics industry.