Advantages of BGA | disadvantages of BGA
This page covers advantages and disadvantages of BGA (Ball Grid Array). It mentions BGA advantages or benefits and BGA disadvantages or drawbacks. BGA stands for Ball Grid Array.
What is BGA?
• It is type of SMP (Surface Mount Packaging) used to integrate ICs.
• It is used to mount devices permanently.
• It can provide more connections than DIL (dual in line) or flat packages.
• Complete bottom surface of BGA devices are used rather than just perimeter.
• It conducts signals between ICs and PCBs.
• It utilizes small solder balls for connection between the component and board.
• It offers less inductance and hence less signal degradation.
• The active chip in a BGA package can be interconnected to the package by wirebonding.
Following are the typical types of BGAs (Ball Grid Arrays).
• Plastic Ball Grid Array (PBGA), as shown in the figure-1.
• Cavity Plastic Ball Grid Array (CPBGA)
• Ceramic Ball Grid Array (CBGA)
• Tape Ball Grid Array (TBGA)
Benefits or advantages of BGA
Following are the benefits or advantages of BGA:
➨It is used in Microcontrollers, Microprocessors, RAM devices, PC Chipsets etc.
➨It has lower inductance power planes which support high frequency designs.
➨It supports higher pin counts compare to wirebond packages.
➨It has improved current distribution which minimizes IR drops. In BGA, power is distributed through top metal layer metal bumps.
➨(PBGA type:) Excellent thermal compatibility with PCB
➨PBGA type supports excellent electrical performance.
➨CBGA and TBGA support better heat dissipation compare to PBGA type.
Drawbacks or disadvantages of BGA
Following are the disadvantages of BGA:
➨PBGA and TBGA are sensitive to humidity.
➨CBGA type has bad thermal compatibility with PCB. It is higher in cost. It has bad autoregistration capability.
➨TBGA is relatively low in reliability.